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For brush motors
H-bridge drivers (18V max.)
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Overview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow for PWM signal control, while the integrated VREF voltage control function of previous models offers direct replacement of deprecated motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design.
No.09007ECT02
Features 1) Built-in, selectable one channel or two channels configuration 2) Low standby current 3) Supports PWM control signal input (20kHz to 100kHz) 4) VREF voltage setting pin enables PWM duty control 5) Cross-conduction prevention circuit 6) Four protection circuits provided: OCP, OVP, TSD and UVLO
Applications VCR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals; car audios; car navigation systems; OA equipments
Line up matrix Rating voltage Channels Maximum output current 0.5A BD6210 HFP / F BD6215 FP BD6220 HFP / F BD6225 FP BD6230 HFP / F BD6235 FP 1.0A BD6211 HFP / F BD6216 FP / FM BD6221 HFP / F BD6226 FP / FM BD6231 HFP / F BD6236 FP / FM 2.0A BD6212 HFP / FP BD6217 FM BD6222 HFP / FP BD6227 FM BD6232 HFP / FP BD6237 FM
1ch 7V 2ch
1ch 18V 2ch
1ch 36V 2ch
*Packages; F:SOP8, HFP:HRP7, FP:HSOP25, FM:HSOP-M28
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1/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Absolute maximum ratings (Ta=25C, All voltages are with respect to ground) Parameter Supply voltage Output current All other input pins Operating temperature Storage temperature Power dissipation Junction temperature
*1 *2 *3 *4 *5 *6 *7
Technical Note
Symbol VCC IOMAX VIN TOPR TSTG Pd Tjmax
4 1
Ratings 18 0.5 * / 1.0 * / 2.0 * -0.3 ~ VCC -40 ~ +85 -55 ~ +150 0.687 * / 1.4 * / 1.45 * / 2.2 * 150
5 6 7 2 3
Unit V A V C C W C
BD6220 / BD6225. Do not, exceed Pd or ASO. BD6221 / BD6226. Do not, exceed Pd or ASO. BD6222 / BD6227. Do not, exceed Pd or ASO. SOP8 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 5.5mW/C above 25C. HRP7 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.2mW/C above 25C. HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.6mW/C above 25C. HSOP-M28 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 17.6mW/C above 25C.
Operating conditions (Ta=25C) Parameter Supply voltage VREF voltage Symbol VCC VREF Ratings 6 ~ 15 3 ~ 15 Unit V V
Electrical characteristics (Unless otherwise specified, Ta=25C and VCC=VREF=12V) Parameter Supply current (1ch) Supply current (2ch) Stand-by current Input high voltage Input low voltage Input bias current Output ON resistance * Output ON resistance * Output ON resistance * VREF bias current Carrier frequency Input frequency range
*1 BD6220 / BD6225 *2 BD6221 / BD6226 *3 BD6222 / BD6227
1 2 3
Symbol ICC ICC ISTBY VIH VIL IIH RON RON RON IVREF FPWM FMAX
Limits Min. 0.8 1.3 2.0 30 1.0 1.0 0.5 -10 20 20 Min. 1.3 2.0 0 50 1.5 1.5 1.0 0 25 Min. 2.5 3.5 10 0.8 100 2.5 2.5 1.5 10 35 100
Limits mA mA A V V A A kHz kHz VIN=5.0V
Conditions Forward / Reverse / Brake Forward / Reverse / Brake Stand-by
IO=0.25A, vertically total IO=0.5A, vertically total IO=1.0A, vertically total VREF=VCC VREF=9V FIN / RIN
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2/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Electrical characteristic curves (Reference data)
2.0 85C 25C -40C 1.5 2.5 1.5
Technical Note
Circuit Current: Icc [mA]
Circuit Current: Icc [mA]
Internal Logic: H/L [-] _
1.0
2.0
-40C 25C 85C -40C 25C 85C
0.5
1.0
1.5
85C 25C -40C
0.0
0.5 6 9 12 15 18 Supply Voltage: Vcc [V]
1.0 6 9 12 15 18 Supply Voltage: Vcc [V]
-0.5 1 1.2 1.4 1.6 1.8 2 Input Voltage: VIN [V]
Fig.1 Supply current (1ch)
400 Input Bias Current: IVREF [ A] 85C 25C -40C 10
Fig.2 Supply current (2ch)
1.0 -40C 25C 85C
Fig.3 Input threshold voltage
Input Bias Current: IIH [A] _
300
5
Switching Duty: D [Ton/T] _
0.8
0.6
200
0
0.4 -40C 25C 85C
100
-5
0.2
0 0 6 12 18 Input Voltage: VIN [V]
-10 0 6 12 18 Input Voltage: VREF [V]
0.0 0 0.2 0.4 0.6 0.8 1 Input Voltage: VREF / VCC [V]
Fig.4 Input bias current
40 Oscillation Frequency: F PWM [kHz] 9
Fig.5 VREF input bias current
35 85C 25C -40C 6
Fig.6 VREF - DUTY (VCC=12V)
-40C 25C 85C
Internal signal: Release [V] _
30
Internal signal: Release [V] _ 6
85C 25C -40C
28
21
14
20
3
7
10 6 9 12 15 18 Supply Voltage: VCC [V]
0 4 4.5 5 5.5 Supply Voltage: VCC [V]
0 20 24 28 32 Supply Voltage: VCC [V]
Fig.7 VCC - Carrier frequency
1.5 1.5
Fig.8 Under voltage lock out
1.5
Fig.9 Over voltage protection
85C 25C -40C Internal Logic: H/L [-] _
85C 25C -40C
0.5
Internal Logic: H/L [-] _
Internal Logic: H/L [-]
1.0
1.0
1.0
0.5
0.5
0.0
0.0
0.0
-0.5 125 150 175 200 Junction Temperature: Tj [C]
-0.5 2 2.5 3 3.5 4 Load Current / Iomax: Normalized
-0.5 1 1.25 1.5 1.75 2 Load Current / Iomax: Normalized
Fig.10 Thermal shutdown
Fig.11 Over current protection (H side)
Fig.12
Over current protection (L side)
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3/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Electrical characteristic curves (Reference data) - Continued
0.4 Output Voltage: VCC-VOUT [V] Output Voltage: VCC-VOUT [V] 85C 25C -40C 0.8
Technical Note
0.4 Output Voltage: VCC-VOUT [V]
85C 25C -40C
0.3
0.6
0.3
85C 25C -40C
0.2
0.4
0.2
0.1
0.2
0.1
0 0 0.1 0.2 0.3 0.4 0.5 Output Current: IOUT [A]
0 0 0.2 0.4 0.6 0.8 1 Output Current: IOUT [A]
0 0 0.1 0.2 0.3 0.4 0.5 Output Current: IOUT [A]
Fig.13 Output high voltage (0.5A class)
2 Output Voltage:VCC- VOUT [V] Output Voltage:VCC- VOUT [V] -40C 25C 85C
Fig.14 Output high voltage (1A class)
2
Fig.15 Output high voltage (2A class)
2 Output Voltage:VCC- VOUT [V]
1.5
1.5
-40C 25C 85C
1.5
-40C 25C 85C
1
1
1
0.5
0.5
0.5
0 0 0.1 0.2 0.3 0.4 0.5 Output Current: IOUT [A]
0 0 0.2 0.4 0.6 0.8 1 Output Current: IOUT [A]
0 0 0.4 0.8 1.2 1.6 2 Output Current: IOUT [A]
Fig.16 High side body diode (0.5A class) Fig.17 High side body diode (1A class) Fig.18 High side body diode (2A class)
0.4 1.2 85C 25C -40C 1.2
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
0.3
0.9
Output Voltage: VOUT [V]
85C 25C -40C
85C 25C -40C
0.9
0.2
0.6
0.6
0.1
0.3
0.3
0 0 0.1 0.2 0.3 0.4 0.5 Output Current: IOUT [A]
0 0 0.2 0.4 0.6 0.8 1 Output Current: IOUT [A]
0 0 0.4 0.8 1.2 1.6 2 Output Current: IOUT [A]
Fig.19 Output low voltage (0.5A class)
2
Fig.20 Output low voltage (1A class)
2 -40C 25C 85C
Fig.21 Output low voltage (2A class)
2
Output Voltage: VOUT [V]_
Output Voltage: VOUT [V]_
1.5
1.5
Output Voltage: VOUT [V]_
-40C 25C 85C
-40C 25C 85C
1.5
1
1
1
0.5
0.5
0.5
0 0 0.1 0.2 0.3 0.4 0.5 Output Current: IOUT [A]
0 0 0.2 0.4 0.6 0.8 1 Output Current: IOUT [A]
0 0 0.4 0.8 1.2 1.6 2 Output Current: IOUT [A]
Fig.22 Low side body diode (0.5A class) Fig.23 Low side body diode (1A class)
Fig.24 Low side body diode (2A class)
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4/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Block diagram and pin configuration BD6220F / BD6221F
Technical Note
VREF
6
DUTY
PROTECT 3 2 VCC VCC
Table 1 BD6220F/BD6221F Pin 1 2 3
8 1 OUT1 7 OUT2 GND
Name OUT1 VCC VCC FIN RIN VREF OUT2 GND
Function Driver output Power supply Power supply Control input (forward) Control input (reverse) Duty setting pin Driver output Ground
FIN RIN
4 CTRL 5
4 5 6 7 8
Fig.25 BD6220F / BD6221F
OUT1 VCC VCC FIN
GND OUT2 VREF RIN
Note: Use all VCC pin by the same voltage.
Fig.26 SOP8
BD6220HFP / BD6221HFP / BD6222HFP Table 2 BD6220HFP/BD6221HFP/BD6222HFP Pin
7 FIN RIN 3 CTRL 5 4 FIN GND 2 OUT1 6 OUT2 GND VCC
VREF
1
DUTY
PROTECT
Name VREF OUT1 FIN GND RIN OUT2 VCC GND
Function Duty setting pin Driver output Control input (forward) Ground Control input (reverse) Driver output Power supply Ground
1 2 3 4 5 6 7 FIN
Fig.27 BD6220HFP / BD6221HFP / BD6222HFP
Fig.28 HRP7
VCC OUT2 RIN GND FIN OUT1 VREF
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5/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Block diagram and pin configuration - Continued BD6222FP
VREF 17 DUTY PROTECT 21 22 23 FIN 20 CTRL RIN 19 7 8 6 GND FIN GND 1 2 12 13 OUT2 VCC VCC
Technical Note
Table 3 BD6222FP Pin 1,2 6 7,8
RNF
Name OUT1 GND RNF OUT2 VREF RIN FIN VCC VCC GND
Function Driver output Small signal ground Power stage ground Driver output Duty setting pin Control input (reverse) Control input (forward) Power supply Power supply Ground
12,13 17 19 20 21 22,23 FIN
OUT1
Fig.29 BD6222FP
OUT1 OUT1 NC NC NC GND GND RNF RNF NC NC NC OUT2 OUT2 NC NC VCC VCC VCC FIN GND RIN NC VREF NC NC NC
Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage.
Fig.30 HSOP25 BD6225FP / BD6226FP Table 4 BD6225FP / BD6226FP
24 25 FINA 11 CTRL RINA 10 1 6 OUT1A OUT2A VCC VCC
VREFA
9
DUTY
PROTECT
Pin 1 3 6 8 9 10 11 12 13 14 16 19 20 21 22 23 24 25 FIN
Name OUT1A RNFA OUT2A GND VREFA RINA FINA VCC VCC OUT1B RNFB OUT2B GND VREFB RINB FINB VCC VCC GND
Function Driver output Power stage ground Driver output Small signal ground Duty setting pin Control input (reverse) Control input (forward) Power supply Power supply Driver output Power stage ground Driver output Small signal ground Duty setting pin Control input (reverse) Control input (forward) Power supply Power supply Ground
GND
20 DUTY PROTECT
3
RNFA
VREFB 21
12 13 FINB 23 CTRL RINB 22 14 19
VCC VCC
OUT1B OUT2B
GND
8 FIN GND
16
RNFB
Fig.31 BD6225FP / BD6226FP
OUT1A NC RNFA NC NC OUT2A GND NC GND VREFA RINA FINA VCC VCC VCC VCC FINB RINB VREFB GND GND OUT2B NC NC RNFB NC OUT1B
Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage.
Fig.32 HSOP25
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6/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Block diagram and pin configuration - Continued BD6226FM Table 5 BD6226FM
26 28 FINA 11 CTRL RINA 10 1 6 OUT1A OUT2A VCC VCC
Technical Note
VREFA
9
DUTY
PROTECT
Pin 1 3 6 8 9
Name OUT1A RNFA OUT2A GND VREFA RINA FINA VCC VCC OUT1B RNFB OUT2B GND VREFB RINB FINB VCC VCC GND
Function Driver output Power stage ground Driver output Small signal ground Duty setting pin Control input (reverse) Control input (forward) Power supply Power supply Driver output Power stage ground Driver output Small signal ground Duty setting pin Control input (reverse) Control input (forward) Power supply Power supply Ground
GND
22 DUTY PROTECT
3
RNFA
VREFB 23
12 14 FINB 25 CTRL RINB 24 15 20
VCC VCC
10 11 12 14 15 17 20 22 23 24 25 26
OUT1B OUT2B
GND
8 FIN GND
17
RNFB
Fig.33 BD6226FM
OUT1A NC RNFA NC NC OUT2A NC
VCC NC VCC FINB RINB VREFB GND
28 FIN
Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage.
GND
GND
GND VREFA RINA FINA VCC NC VCC
NC OUT2B NC NC RNFB NC OUT1B
Fig.34 HSOP-M28
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7/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Block diagram and pin configuration - Continued BD6227FM
Technical Note
VREFA
9
DUTY
PROTECT
26 27 28
VCC
Table 6 BD6227FM Pin 1,2 3,4 6,7 8 9 10 11 12 13,14 15,16 17,18 20,21 22 23 24 25 26 27,28 FIN Name OUT1A RNF A OUT2A GND VREFA RINA FINA VCC VCC OUT1B RNFB OUT2B GND VREFB RINB FINB VCC VCC GND Function Driver output Power stage ground Driver output Small signal ground Duty setting pin Control input (reverse) Control input (forward) Power supply Power supply Driver output Power stage ground Driver output Small signal ground Duty setting pin Control input (reverse) Control input (forward) Power supply Power supply Ground
VCC
FINA 11 CTRL RINA 10
1 2 6 7
OUT1A
OUT2A
GND 22
3 4
RNFA
VREFB 23
DUTY
PROTECT
12 13 14
VCC
VCC
FINB 25 CTRL RINB 24
15 16 20 21
OUT1B
OUT2B
GND
8
17 18 FIN GND
RNFB
Fig.35 BD6227FM
OUT1A OUT1A RNFA RNFA NC OUT2A OUT2A
VCC VCC VCC FINB RINB VREFB GND
Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage. GND GND
GND VREFA RINA FINA VCC VCC VCC
OUT2B OUT2B NC RNFB RNFB OUT1B OUT1B
Fig.36 HSOP-M28
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8/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Functional descriptions 1) Operation modes Table 7 Logic table FIN a b c d e f g h i j L H L H PWM L H PWM H L RIN L L H H L PWM PWM H L H VREF X VCC VCC X VCC VCC VCC VCC Option Option OUT1 Hi-Z* H L L H
__________
Technical Note
OUT2 Hi-Z* L H L
__________
Operation Stand-by (idling) Forward (OUT1 > OUT2) Reverse (OUT1 < OUT2) Brake (stop) Forward (PWM control mode A) Reverse (PWM control mode A) Forward (PWM control mode B) Reverse (PWM control mode B) Forward (VREF control) Reverse (VREF control)
PWM H L
PWM L H
__________
PWM
__________
PWM H
__________
PWM
__________
PWM
* Hi-Z is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay. X : Don't care
a) Stand-by mode Stand-by operates independently of the VREF pin voltage. In stand-by mode, all internal circuits are turned off, including the output power transistors. Motor output goes to high impedance. If the motor is running at the switch to stand-by mode, the system enters an idling state because of the body diodes. However, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50s before shutting down all circuits. b) Forward mode This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. For operation in this mode, connect the VREF pin with VCC pin. c) Reverse mode This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. For operation in this mode, connect the VREF pin with VCC pin. d) Brake mode This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because the internal control circuit is operating in the brake mode. Please switch to the stand-by mode (rather than the brake mode) to save power and reduce consumption.
OFF M OFF
OFF
ON M
OFF OFF M ON ON
ON OFF
OFF M ON
OFF ON
OFF OFF
a) Stand-by mode
b) Forward mode
c) Reverse mode
d) Brake mode
Fig.37 Four basic operations (output stage)
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9/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Technical Note
e) f) PWM control mode A The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN pin or the RIN pin. In this mode, the high side output is fixed and the low side output does the switching, corresponding to the input signal. The switching operates by the output state toggling between "L" and "Hi-Z". The PWM frequency can be input in the range between 20kHz and 100kHz. Note that control may not be attained by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. Also, circuit operation may not respond correctly when the input signal is higher than 100kHz. To operate in this mode, connect the VREF pin with VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10F or more is recommended) between VCC and ground.
ON M OFF
OFF ON
ON M OFF
OFF OFF
Control input : H
Control input : L
Fig.38 PWM control mode A operation (output stage)
FIN RIN OUT1 OUT2
Fig.39 PWM control mode A operation (timing chart) g) h) PWM control mode B The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN pin or the RIN pin. In this mode, the low side output is fixed and the high side output does the switching, corresponding to the input signal. The switching operates by the output state toggling between "L" and "H". The PWM frequency can be input in the range between 20kHz and 100kHz. Also, circuit operation may not respond correctly when the input signal is higher than 100kHz. To operate in this mode, connect the VREF pin with VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10F or more is recommended) between VCC and ground.
OFF M ON
OFF ON
ON M OFF
OFF ON
Control input : H
Control input : L
Fig.40 PWM control mode B operation (output stage)
FIN RIN OUT1 OUT2
Fig.41 PWM control mode B operation (timing chart)
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10/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Technical Note
i) j) VREF control mode The built-in VREF-switching on duty conversion circuit provides switching duty corresponding to the voltage of the VREF pin and the VCC voltage. The function offers the same level of control as the high voltage output setting function in previous models. The on duty is shown by the following equation. DUTY VREF [V] / VCC [V] For example, if VCC voltage is 12V and VREF pin voltage is 9V, the switching on duty is about 75 percent. However, please note that the switching on duty might be limited by the range of VREF pin voltage (Refer to the operating conditions, shown on page 2). The PWM carrier frequency in this mode is 25kHz (nominal), and the switching operation is the same as it is the PWM control modes. When operating in this mode, do not input the PWM signal to the FIN and RIN pins. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10F or more is recommended) between VCC and ground.
VCC VREF 0 FIN RIN OUT1 OUT2
Fig.42 VREF control operation (timing chart)
2) Cross-conduction protection circuit In the full bridge output stage, when the upper and lower transistors are turned on at the same time, and this condition exists during the period of transition from high to low, or low to high, a rush current flows from the power supply to ground, resulting in a loss. This circuit protects against the rush current by providing a dead time (about 400ns, nominal) at the transition. 3) Output protection circuits a) Under voltage lock out (UVLO) circuit To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 5.0V (nominal) or below, the controller forces all driver outputs to high impedance. When the voltage rises to 5.5V (nominal) or above, the UVLO circuit ends the lockout operation and returns the chip to normal operation. b) Over voltage protection (OVP) circuit When the power supply voltage exceeds 30V (nominal), the controller forces all driver outputs to high impedance. The OVP circuit is released and its operation ends when the voltage drops back to 25V (nominal) or below. This protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.
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11/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Technical Note
c) Thermal shutdown (TSD) circuit The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175C nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (150C nominal). Thus, it is a self-returning type circuit. The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. d) Over current protection (OCP) circuit To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors the output current for the circuit's monitoring time (10s, nominal). When the protection circuit detects an over current, the controller forces all driver outputs to high impedance during the off time (290s, nominal). The IC returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this circuit works independently for each channel.
Threshold Iout
0 CTRL Input Internal status Monitor / Timer ON mon. OFF off timer ON
Fig.43
Over current protection (timing chart)
Interfaces
VCC VCC FIN RIN 100k 100k VCC VREF 10k OUT1 OUT2 OUT1 OUT2 VCC
GND
RNF GND
Fig.44 FIN / RIN
Fig.45 VREF
Fig.46 OUT1 / OUT2
(SOP8/HRP7)
Fig.47 OUT1 / OUT2
(HSOP25/HSOPM28)
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c 2009 ROHM Co., Ltd. All rights reserved.
12/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Notes for use
Technical Note
1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures - such as adding fuses - if any value in excess of absolute maximum ratings is to be implemented. 2) Connecting the power supply connector backward Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as adding an external direction diode. 3) Power supply lines Return current generated by the motor's Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10F, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors - including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND. 4) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set's reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the same way, care must be taken to avoid changes in the GND wire pattern in any external connected component. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error, or if pins are shorted together. 7) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields. 8) ASO - Area of Safety Operation When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9) Built-in thermal shutdown (TSD) circuit The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. 10) Capacitor between output and GND In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1F between output and GND.
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13/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Technical Note
11) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 12) Switching noise When the operation mode is in PWM control or VREF control, PWM switching noise may effects to the control input pins and cause IC malfunctions. In this case, insert a pulled down resistor (10k is recommended) between each control input pin and ground. 13) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin.
Pin A Resistor Pin A
P
+
Pin B
C
B E
Transistor (NPN)
Pin B
N P P
+
N
N
Parasitic element
N
P+
N P P
+
B N
C E
P substrate Parasitic element
GND
P substrate Parasitic element
GND GND GND
Parasitic element
Other adjacent elements
Appendix: Example of monolithic IC structure
Ordering part number
B
D
6
2
2
0
F
Package F: SOP8 FP: HSOP25 FM: HSOP-M28 HFP: HRP7
-
E
2
ROHM part number
Type 1X: 7V max. 2X: 18V max. 3X: 36V max. X0: 1ch/0.5A X5: 2ch/0.5A X1: 1ch/1A X6: 2ch/1A X2 1 h/2A X7 2 h/2A
Packaging spec. E2: Embossed taping (SOP8/HSOP25/HSOP-M28) TR: Embossed taping (HRP7)
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c 2009 ROHM Co., Ltd. All rights reserved.
14/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
SOP8
Tape Quantity Direction of feed Embossed carrier tape 2500pcs E2
Technical Note
(Holding the reel with the left hand and pulling the tape out with the right, pin 1 will be on the upper left-hand side.)
1234
(Unit:mm)
Reel
1234
1234
1Pin
*Orders should be placed in multiples of package quantity.
1234
1234
1234
Direction of feed
1234
1234
HSOP25
Tape
13.6 0.2
25
Embossed carrier tape 2000pcs E2
(Holding the reel with the left hand and pulling the tape out with the right, pin 1 will be on the upper left-hand side.)
Quantity
14
2.75 0.1
7.8 0.3
5.4 0.2
1
1.95 0.1 0.8
13
0.25 0.1
1.9 0.1
0.11
0.3Min.
Direction of feed
1234
1234
1234
1234
1234
1234
1234
1234
0.1 0.36 0.1
(Unit:mm)
Reel
1Pin
Direction of feed
*Orders should be placed in multiples of package quantity.
HSOP-M28
Tape
18.5 0.2
28 15
Embossed carrier tape 1500pcs E2
(Holding the reel with the left hand and pulling the tape out with the right, pin 1 will be on the upper left-hand side.)
Quantity
0.5 0.2
9.9 0.3
7.5 0.2
Direction of feed
1
5.15 0.1 0.8
14
0.25 0.1
2.2 0.1
0.11
1234
1234
1234
1234
1234
1234
1234
1234
0.35 0.1 0.08 M 16.0 0.2
0.1 S
(Unit:mm)
Reel
1Pin
Direction of feed
*Orders should be placed in multiples of package quantity.
HRP7
1.017 0.2
9.395 0.125 (MAX 9.745 include BURR) 8.82 - 0.1 (5.59) 1.905 0.1

Tape Quantity Direction of feed Embossed carrier tape 2000pcs TR
(Holding the reel with the left hand and pulling the tape out with the right, pin 1 will be on the upper right-hand side.)
8.0 0.13
(7.49)
12 0.8875
3
4
5
6
7 4.5 0.27 S
+5.5 -4.5 +0.1 -0.05
0.835 0.2
1.523 0.15 10.54 0.13
xxxx
xxxx
xxxx
xxxx
xxxx
xxxx
0.08 0.05
1.27
0.73 0.1 0.08 S
1Pin
Direction of feed
(Unit:mm)
Reel
*Orders should be placed in multiples of package quantity.
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c 2009 ROHM Co., Ltd. All rights reserved.
15/16
2009.08 - Rev.C
BD6220, BD6221, BD6222, BD6225, BD6226, BD6227
Technical Note
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c 2009 ROHM Co., Ltd. All rights reserved.
16/16
2009.08 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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